Chiplets are single silicon dies that are mainly designed combined with other dies. These dies can be put together in different arrangements. It includes vertical stacking, and then these are mounted onto a single substrate layer, and after that it is packed. Interconnections between the individual chiplets can be achieved in many ways like bond wires and different using metallic via.
Recently, one of the famous companies .i.e. Intel has secured a contract with the US military to produce chips utilizing chiplest technology. A semiconductor that uses the chiplets generally splits up its design into major subcircuits. It also includes an analog front end, processor, memory, and GPU. It is increasing its popularity. But they are still a niche market when they are compared to standard monolithic designs which use a single piece of semiconductor.
The chiplets are gaining so popularity as the chiplets stems from the issues faced by semiconductor manufactures as a result of increasingly smaller transistors. Semiconductor companies of the past did not require stringent clean rooms. As in the past, the semiconductor used to use the transistor sizes that were in the micrometer scale, and at this scale, dust would generally not cause an issue in operation. Similar semiconductors were also more resilient to point defects. It does from the past which was easier to mass produce.
Now the current scale of transistors is now at the sub 10nm. It means that the semiconductor foundries need to be incredibly clean with as little dust in the air as possible. It is because of the dust particle which is landing on a 10nm transistor. It will not only damage the transistor but it will also affect the many thousands of transistors nearly.
As a result of the size of the dust particle .i.e. dust particles are several orders of magnitude greater than 10nm transistors. The other issues that the small transistors face like individual point defects in a semiconductor can result in faulty transistors. Increasing the yields of the dies with small transistor sizes can be achieved by reducing the overall size of the die. This resulted in fewer transistors fitting into a single die.
The size of the transistors will be increased it will help the more transistors and therefore more circuity. It may result in an increase in the cost of each die as more are discarded through failure.
There is one solution is to use chiplets , and this is a solution that has started to become more popular. Chiplets that are smaller dies can utilize modern sub 10nm transistor features. It allows for powerful complex functions. The last device integrates multiple Chiplets into a single package. The net result is a powerful device with a high transistor count that reduces the number of failed dies. It will help in reducing the final cost of the die and it will also maximize the yields.
The US military has chosen Intel for its chip supplier. As Intel has won a second phase contract with the US military. So that it will provide the next generation military tech through the advanced semiconductors.
The use of Chiplets technology not only allows for a more economical solution when using sub 10nm node technology. But it allows for dies designed by other manufacturers to be integrated into a single custom package. It will also allow the high specific applications to make the most of the semiconductor devices. Intel a company which has not released the dollar figure for the program. The reasoning for the Intel being chosen by the US military is well established.
Almost 75% of the world semiconductor devices are manufactured in Asia. Intel is a company whose manufacturing facilitates are located locally. It has the ability to produce high end processors. It also allows them to produce some of the world’s advanced semiconductors.